Manufacturing capability

Layer
count
4L 2L 6L 6L 8L 10L 12L 14L 16L
Layer
Structure
product
type
Depth
control drill
Copper base
PCB
Buried copper
inlaid
1 + N HDI,
Buries holes
Mechanical back drilling
Etching back drill
2 + N HDI, POFV Heavy,
copper
Countersink
head holes
High layer
count
Item Manufacture Capability Manufacture Capability
Layer 2-30 Layer 2-30 Layer
Thickness 0.3-3.5 mm 0.2-5.0 mm
Laminate Type FR-4、High TG PTFE、PTFE
Copper Foil Thickness 1/3-6 oz 1/3-14 oz
Min.Line Width/Space 75 um/75 um 50 um/60 um
Min. Through hole diameter 0.15 mm 0.15 mm
Micro channel thickness ratio 12:1 15:1
Min. Blind hole diameter 4 mil 4 mil
Blind aperture ratio 0.7:1 1:1
Min. Dielectric thickness 50 um 25 um
Wiring layer 2+N+2 3+N+3
Surface Finish HASL,ENIG,Immersion Tin,Immersion Silver,OSP

Layer Count Distribution

  • 2L 25%
  • 6L 30%
  • 4L 25%
  • 8L 15%
  • 10 L and above 7%
  • HDI 3%

Certification

A solid step
With all the certifications we obtain over the years demonstrate stable growth as a strong enterprise with
viable intellect and creative innovation abilities.
Location Certification Certification
body
Certification number
Guangdong
division
ISO9001 BSI FM523401
TS16949 BSI TS523400
ISO14001 KSR CNASC163E14E20050R1M
OHSAS18001 WIT 15/16S0327R00
Location Certification Certification
body
Certification number
Hunan
division
ISO9001 BSI FM575265
TS16949 BSI TS575264
ISO14001 WIT 15/16E5201R11
OHSAS18001 WIT 15/16S5202R01

Major equipment

ASK operate with most advance equipment in the industry to provide efficient production and high quality
products with value added to our partners
Aoshikang Technology Co. Ltd @ All rights reserved  ICP08111400
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